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XPG SX8200 Pro M.2 256 GB PCI Express 3.0 3D TLC NVMe
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(0808 189 1246)
Hard drive
PCI Express interface data lanes
x4
SSD capacity
256 GB
Memory type
3D TLC
Data transmission
Read speed
3500 MB/s
Write speed
1200 MB/s
Random write (4KB)
290000 IOPS
Random read (4KB)
220000 IOPS
Endurance
Mean time between failures (MTBF)
2000000 h
Performance
Interface
PCI Express 3.0
Component for
PC/notebook
NVMe
Yes
NVMe version
1.3
Low-density parity-check (LDPC)
Yes
NAND flash type
TLC (Triple Level Cell)
End-to-End Data Protection
Yes
PCI Express interface data lanes
x4
SSD capacity
256 GB
Read speed
3500 MB/s
RAID support
Yes
Write speed
1200 MB/s
ECC
Yes
Memory type
3D TLC
Random write (4KB)
290000 IOPS
Random read (4KB)
220000 IOPS
Mean time between failures (MTBF)
2000000 h
Design
Component for
PC/notebook
Product colour
Black
SSD form factor
M.2
Features
Interface
PCI Express 3.0
Component for
PC/notebook
NVMe
Yes
NVMe version
1.3
Low-density parity-check (LDPC)
Yes
NAND flash type
TLC (Triple Level Cell)
End-to-End Data Protection
Yes
PCI Express interface data lanes
x4
SSD capacity
256 GB
Read speed
3500 MB/s
RAID support
Yes
Write speed
1200 MB/s
ECC
Yes
Memory type
3D TLC
Random write (4KB)
290000 IOPS
Random read (4KB)
220000 IOPS
Mean time between failures (MTBF)
2000000 h
SSD form factor
M.2
Harmonized System (HS) code
84717070
Operational conditions
Operating temperature (T-T)
0 - 70 °C
Storage temperature (T-T)
-40 - 85 °C
Operating relative humidity (H-H)
5 - 95%
Operating shock
1500 G
Technical details
Interface
PCI Express 3.0
Operating temperature (T-T)
0 - 70 °C
RAID support
Yes
Storage temperature (T-T)
-40 - 85 °C
Operating relative humidity (H-H)
5 - 95%
ECC
Yes
Operating shock
1500 G
Product colour
Black
SSD form factor
M.2
Sustainability certificates
RoHS
Weight & dimensions
Width
80 mm
Weight
8 g
Height
3.5 mm
Depth
22 mm
XPG SX8200 Pro M.2 256 GB PCI Express 3.0 3D TLC NVMe
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