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$25.15
$30.18 (Inc. VAT)
Power
Memory voltage
1.35 V
Design
Backlight colour
Red/Green/Blue
Backlight
Yes
Cooling type
Heatsink
JEDEC standard
Yes
Technical details
Country of origin
China, Taiwan
Cooling type
Heatsink
Memory
Buffered memory type
Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)
Yes
Intel Extreme Memory Profile (XMP) version
2.0
Memory layout (modules x size)
1 x 8 GB
Internal memory
8 GB
Component for
PC/Server
Memory form factor
288-pin DIMM
CAS latency
17
Memory voltage
1.35 V
Lead plating
Gold
Module configuration
1024M x 64
Row cycle time
45.75 ns
Refresh row cycle time
350 ns
Row active time
32 ns
SPD profile
Yes
Memory ranking
1
ECC
No
Internal memory type
DDR4
Programming power voltage (VPP)
2.5 V
Features
Buffered memory type
Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)
Yes
Intel Extreme Memory Profile (XMP) version
2.0
Backlight colour
Red/Green/Blue
Backlight
Yes
Memory layout (modules x size)
1 x 8 GB
Internal memory
8 GB
Component for
PC/Server
Memory form factor
288-pin DIMM
CAS latency
17
Memory voltage
1.35 V
Lead plating
Gold
Module configuration
1024M x 64
Row cycle time
45.75 ns
Refresh row cycle time
350 ns
Row active time
32 ns
SPD profile
Yes
Country of origin
China, Taiwan
Cooling type
Heatsink
Memory ranking
1
ECC
No
Internal memory type
DDR4
Programming power voltage (VPP)
2.5 V
JEDEC standard
Yes
Memory data transfer rate
3600 MT/s
Operational conditions
Operating temperature (T-T)
0 - 70 °C
Storage temperature (T-T)
-40 - 85 °C
Weight & dimensions
Package width
63.5 mm
Package depth
14 mm
Package height
171.5 mm
Width
7.1 mm
Depth
133.4 mm
Height
41.1 mm
Weight
38.8 g
Package weight
57.7 g
Packaging data
Package width
63.5 mm
Package depth
14 mm
Package height
171.5 mm
Package weight
57.7 g
Logistics data
Master (outer) case width
193 mm
Master (outer) case length
325.1 mm
Master (outer) case height
88.9 mm
Master (outer) case gross weight
1.68 kg
Products per master (outer) case
25 pc(s)
Other features
Country of origin
China, Taiwan
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