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Hard drive
SSD capacity
512 GB
Memory type
3D TLC
Data transmission
Read speed
3180 MB/s
Write speed
2960 MB/s
Data transfer rate
32 Gbit/s
Endurance
Mean time between failures (MTBF)
1500000 h
Performance
Interface
PCI Express 3.1
Component for
PC/notebook
NVMe
Yes
SSD capacity
512 GB
Read speed
3180 MB/s
Write speed
2960 MB/s
Memory type
3D TLC
Mean time between failures (MTBF)
1500000 h
Hardware encryption
No
Data transfer rate
32 Gbit/s
Design
Component for
PC/notebook
SSD form factor
M.2
Features
Interface
PCI Express 3.1
Component for
PC/notebook
NVMe
Yes
SSD capacity
512 GB
Read speed
3180 MB/s
Write speed
2960 MB/s
Memory type
3D TLC
Mean time between failures (MTBF)
1500000 h
Hardware encryption
No
Data transfer rate
32 Gbit/s
SSD form factor
M.2
Harmonized System (HS) code
84717070
Power
Power consumption (max)
4.7 W
Operating voltage
3.3 V
Operational conditions
Operating temperature (T-T)
0 - 95 °C
Storage temperature (T-T)
-40 - 85 °C
Operating shock
1500 G
Operating vibration
20 G
Technical details
Interface
PCI Express 3.1
Operating temperature (T-T)
0 - 95 °C
Storage temperature (T-T)
-40 - 85 °C
Operating shock
1500 G
Operating vibration
20 G
Hardware encryption
No
SSD form factor
M.2
Weight & dimensions
Width
22 mm
Weight
7.3 g
Height
2.23 mm
Depth
80 mm
Toshiba XG6 M.2 512 GB PCI Express 3.1 3D TLC NVMe
| Weight | 0.01 kgs |
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